Základní desky (motherboards)

3rd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s Intel® C621A Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 6TB Intel® Optane™ Persistent Memory 200 Series, in 16 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode. 6 PCI-E 4.0 x16, 1 PCI-E 4.0 x8 (in x4 slot) M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2280/22110, 2280/22110 M.2 Key: M-Key Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor® 5, Watchdog Dual LAN with Intel® X550 10GBase-T Ethernet Controller Integrated IPMI 2.0 and KVM with Dedicated LAN 5 USB 3.0 ports, 4 USB 2.0 ports HD Audio with optical S/PDIF

Intel® Celeron® 4305UE Processor Dual Channel DDR4 2133MHz SO-DIMM, up to 64GB Intel UHD Graphics 610 with 4K and 24 EU for Vision Solution 3 display support(DP++, HDMI and 48-bit LVDS) Small form factor with rich I/O: 2 GbE, 8 USB and 6 COM Rich expansion: 3 x M.2 (B/E/M key) for NVMe/SATA/Wifi/BT/LTE 12-24V wide range power input with RVP and TVS

1. Single socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 and E5-1600 v4†/ v3 family 2. Intel® C612 chipset 3. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 4. Expansion slots: 1 PCI-E 3.0 x8 (in x16)

13th/12th Generation Intel® Core™ i9/i7/i5/i3/Pentium/Celeron Processor, Single Socket LGA-1700 supported, CPU TDP supports Up to 125W TDP (**bios v2.1 or above) Intel® Q670E Up to 128GB Unbuffered non-ECC UDIMM, DDR5-4400MHz, in 4 DIMM slots 1 PCIe 5.0 x16 slot, 2 PCIe 4.0 x4 slots, 1 PCIe 4.0 x4 OCulink port M.2 Interface: 1 PCIe 4.0 x4

1.Intel® Q170 Express chipset 2. Up to 64GB DDR4 2400MHz Non-ECC Unbuffered UDIMM; 4 DIMM slots 3. 1 PCI-E 3.0 x16 2 PCI-E 3.0 x4 (in x8 slot) 4. Dual GbE LAN w/ Intel i219LM + i210AT

Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s Intel® C621 Up to 512GB Registered ECC RDIMM, DDR4-2666MHz; Up to 1TB Registered ECC LRDIMM, in 8 DIMM slots 2 PCI-E 3.0 x16

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs 3 PCIe 5.0 x8, 2 PCIe 5.0 x16

System on Chip Intel® Xeon® Processor D-2796NT, CPU TDP 120W, Intel Quick Assist Technology Up to 256GB Registered ECC RDIMM, DDR4-2933MHz; Up to 512GB LRDIMM LRDIMM, DDR4-2933MHz, in 4 DIMM slots 1 PCI-E 4.0 x16

First performance hybrid architecture from Intel 4 independent display with 4K resolution Fast AI hardware acceleration Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2 High speed connectivity through dual 2.5GbE 100% wide temp grade design and components applied 12-24V wide range power with RVP and TVS Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2 Hailo-8™ powerful and efficient Edge AI solution integration ready

Intel® Atom processor E3940 (9.5W, 4C) Intel® Goldmont microarchitecture 14nm System-on-Chip Up to 8GB 1866MHz DDR3L Non-ECC SO-DIMM in 1 socket Quad LAN with Intel® Ethernet Controller I210-IT 3 M.2 B-Key 2242/3042 with nano SIM slot, 1 M.2 E-Key 2230 2 USB 3.0 ports, 2 USB 2.0 ports, 1 COM ports, 1 SATA 3.0, 8-bit GPIO, SMBus Supports 12V DC power input

1. Intel® 2nd and 3rd Gen Core i7/i5/i3, Pentium, Celeron processors, supported; LGA 1155 2. Intel® P67 Express chipset 3. Up to 32GB 1333/1066MHz non-ECC, DDR3 UDIMMs on 4 DIMM slots 4. 1 (x16) PCI-E 2.0 (x8 if slot 4 is used), 1 (x8) PCI-E 2.0 (in x16), 3 (x1) PCI-E, 2.0, and 2 32-bit PCI slots 5. Dual Realtek RTL8111E GbE LAN ports 6. 4x SATA 3.0 (6Gb) w/ RAID 0, 1; 4x SATA 2.0 (3Gb) w/ RAID 0, 1, 5, 10 7. 2x USB 3.0 ports, 12x USB 2.0 ports (8 rear, 4 ports via internal headers) 8. TPM Header ready

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 4. 1x PCI-E 3.0 x32 Left riser slot 1x PCI-E 3.0 x8 Right riser slot