8 GPU

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 4 PCI-E 3.0 x16 (low-profile) slots 2 PCI-E 3.0 x8 (low-profile) slots M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 4. Dual 10GBase-T LAN with Intel® X540 5. 16 Hot-swap 2.5" SATA/SAS drives; Supports 8 NVMe drives 6. 8x 92mm cooling fans 7. 2200W Redundant (2+2) Power Supplies; Titanium Level (96%+)

1.Supports up to 8 double-width GPUs Direct connect for maximum performance 2.Dual AMD EPYC™ 7002 Series Processors 3.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 4.9 PCI-E 4.0 x16 (Option: 10 PCI-E 4.0 x16 slots without NVMe devices) 5.Up to 24 Hot-swap 2.5" drive bays; 4x 2.5" SATA drives and 4x 2.5" NVMe drives supported with included H/W* (*Depends on PCI-E quantity based on #4) 6.2 GbE LAN ports (rear) 7.8 Hot-swap 11.5K RPM cooling fans 8.2000W (2+2) Redundant Power Supplies Titanium Level (96%+)

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series 10 PCI-E Gen 4.0 X16 LP Slots AIOM/OCP 3.0 Support Flexible networking options 2 M.2 NVMe and SATA 6x 2.5" Hot-swap NVMe/SATA/SAS drive bays 4 heavy duty fans with optimal fan speed control 4x 3000W redundant Titanium level power supplies

Supports up to 8 double-width GPUs Direct connect for maximum performance Dual AMD EPYC™ 7003/7002 Series Processors 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 9 PCI-E 4.0 x16 (Option: 10 PCI-E 4.0 x16 slots without NVMe devices) Up to 24 Hot-swap 2.5" drive bays.

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 4 PCI-E 3.0 x16 (low-profile) slots 2 PCI-E 3.0 x8 (low-profile) slots

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 11 PCI-E 3.0 x16 (FH, FL) slots, 1 PCI-E 3.0 x8 (FH, FL in x16 slot) 4. Up to 24 Hot-swap 2.5" drive bays 8x 2.5" SATA drives supported with included H/W, 2x 2.5" NVMe drives supported with included H/W 5. 2x 10GBase-T LAN ports via Intel C622 6. 8 Hot-swap 92mm RPM cooling fans 7. 2000W (2+2) Redundant Power Supplies Titanium Level (96%+)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 4 PCI-E 3.0 x16 (low-profile) slots 2 PCI-E 3.0 x8 (low-profile) slots M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 4. Dual 1GbE LAN with Intel® i350 5. 16 Hot-swap 2.5" SATA/SAS drives; Supports 8 NVMe drives 6. 8x 92mm cooling fans 7. 2200W Redundant (2+2) Power Supplies; Titanium Level (96%+)