Základní desky (motherboards)

Single AMD EPYC™ 7003/7002 Series Processor (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs Expansion slots: 5 PCI-E 4.0 x16 2 PCI-E 4.0 x8 M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 2 M.2, 2 SlimSAS x8 (each: 8 SATA3 or 2 NVMe) Dual 10GBase-T LAN via Broadcom BCM57416 ASPEED AST2500 BMC graphics Up to 6 USB 3.0 ports (4 rear + 2 via header) 7 PWM 4-pin Fans with tachometer status monitoring

Intel® Z170 Express (i3-i7th core support - 6-7th gen.) 64GB Unbuffered non-ECC UDIMM, DDR4-3300MHz (OC), in 4 DIMM slots 3 PCI-E 3.0 x16, 2 PCI-E 3.0 x1***3 PCI-Ex16 slots are running at 16/NA/16 or 16/8/8, 2 PCI-E x1 are in x4 slots

1. Single socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 and E5-1600 v4†/ v3 family 2. Intel® C612 chipset 3. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 4. Expansion slots: 1 PCI-E 3.0 x8 (in x16)

3rd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s Intel® C621A Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 6TB Intel® Optane™ Persistent Memory 200 Series, in 16 DIMM slots; Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode. 6 PCI-E 4.0 x16, 1 PCI-E 4.0 x8 (in x4 slot) M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2280/22110, 2280/22110 M.2 Key: M-Key Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor® 5, Watchdog Dual LAN with Intel® X550 10GBase-T Ethernet Controller Integrated IPMI 2.0 and KVM with Dedicated LAN 5 USB 3.0 ports, 4 USB 2.0 ports HD Audio with optical S/PDIF

Standard Design For mATX, ATX, and eATX Motherboards Compatible With Various X11SPM Series Motherboards High Quality Anti-Rust Material Supermicro Certified

1. Intel® C236 chipset 2. Up to 64GB Unbuffered ECC/non-ECC UDIMM DDR4 2400MHz; 4 DIMM slots 3. 2 PCI-E 3.0 x16 (run at 16/NA or 8/8), 2 PCI-E 3.0 x1, and 2 5V PCI 32-bit slots

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W Intel® C622 chipset Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots

1. Intel® C236 chipset 2. Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4 DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)

Intel® Xeon® Scalable Processors, Intel® Xeon® W-32xx Processor. Single Socket LGA-3647 (Socket P) supported, CPU TDP support 205W TDP Intel® C621 Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz

1. 4th Gen Intel Xeon Scalable, Dual Socket , 350W TDP 2. Support CXL 3. Intel C741 Chipset 4. Up to 4TB 3DS ECC RDIMM DDR5 16 DIMM slots 5. 4 PCIe 5.0 x16

Intel® 11th Generation Core™ i7-1185G7E Processor Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution 4 display support(HDMI2.0b/1.4b, DP1.4 and 48-bit LVDS) High-speed connectivity through dual 2.5GbE, 4 USB3.1 gen2, PCIe 4.0 expansion Rich I/O and expansion: 4 COM, 8 USB, audio with AMP, triple M.2 Accelerated AI inferencing and computer vision in parallel without extra hardware 100% wide temp grade design and components applied 12-24V (10% tolerance) wide range power input support Without heatsink for customers flexible thermal design

Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, Intel® C622 Up to 1.5TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2666MHz,