Workstations

1.Single AMD EPYC™ 7002/7003 Series Processor 2.8 DIMMs; up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3.5 PCI-E 4.0 x16 (FH), 2 PCI-E 4.0 x8 (FH) 4.Integrated IPMI 2.0 + KVM with dedicated LAN • Software Out of Band License  key (SFT-OOB-LIC) included  for OOB BIOS management 5.4 internal 3.5" SATA3 drive bays and 4 internal 2.5" drive bays M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key

2x Intel Xeon E5-2630 v2 128GB memory per node 6x 2.5in 400GB SSD Hard Drives 30x 3.5in 4TB SATA3 HDDs Internal 2.5in OD drives (mirrored 80GB SSD) 4x 10G SFP+ via 2x AOC-STGN-I2S

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8 (slot 1 & 2 occupied by controller and JBOD expansion port) 4. Dual 10GBase-T LAN w/ Intel® X540 5. 36x 3.5" Hot-swap drive bays (24 front + 12 rear): 32x 3.5" Hot-swap SAS3/SATA3 drive bays and 4x NVMe hybrid drive bays (SAS3/SATA3/NVMe*); 2x 2.5" optional Hot-swap SATA drive bays (rear); 4x 2.5" internal fixed drive bays 6. SAS3 via Broadcom 3008 controller; IT mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 7x 80mm middle cooling fans 9. 1280W Redundant Power Supplies Platinum Level (94%)

1. Intel® Atom processor C3338, SoC, FCBGA 1310, CPU TDP support 9W 2. 4 Hot-swap 3.5" SATA drive bays, 2 internal 2.5" drive bays, 1 slim DVD-ROM drive bay (shared with 1 internal 2.5") 3. 1 PCI-E 3.0 x2 (in x4) open ended slot

1. Single socket H4 (LGA 1151) supports Intel® 7th/6th Gen. Core™ i7/i5/i3 series 2. Intel® B250 Express Chipset 3. Up to 64GB Non-ECC UDIMM, DDR4-2400MHz, in 4 DIMM slots 4. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x4, 1 PCI-E 3.0 x1 5. 2x 5.25" drive bays, 2x 3.5" fixed drive bays, 1x 2.5" fixed drive bay 6. 1 HDMI, 1 DP, 1 DVI-D 7. HD Audio 7.1 channel connector by Realtek ALC888S, support SPDIF-Out 8. 1x 80mm Rear Fan 9. 260W 80Plus Bronze Power Supply

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2 GbE LAN ports via Intel i210 5. 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5" SATA drive bays; optional 2 SATA or NVMe 6. Broadcom 3008 SAS3 IT mode (AOC-S3008L-L8E) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5 Hot-swap 8cm redundant PWM fans 9. 1600W Redundant Power Supplies Platinum Level

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 (for SIOM ) 4. 2 Fixed 3.5" SATA3 drive bays M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key 5. Dual GbE ports via SIOM Network card, 1 dedicated IPMI LAN port (front) 6. 1 VGA, 2 USB 3.0 ports (front) 7. 8x 8cm 13.5k RPM rear fans per enclosure 8. 2200W Redundant Power Supplies Titanium Level (96% Efficiency)

1. Single Socket R4 (LGA 2066) supports Intel® Xeon® W-2200 processor, Intel® Xeon® W-2100 processor 2. Intel® C422 chipset 3. Up to 512GB reg. ECC LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 4. 3 PCI-E 3.0 x16 (8/16/16, 48 lanes), 1 PCI-E 3.0 x4, M.2 Interface: 2 PCI-E 3.0 x4 M.2 Form Factor: 22110/2280 M.2 Key: M-Key (RAID 0,1 support) U.2 Interface: 2 PCI-E 3.0 x4 5. ALC 1220 7.1 HD Audio, 1 COM, 5GbE and GbE LAN, 2 USB 3.0 (front) 6. 4 internal 3.5" drive bays 7. 900W High Efficiency Power Supply

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options

1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 and E5-2600 v2 family† 2. Up to 1TB ECC DDR3, up to 1866MHz; 16x DIMM slots 3. 5x PCI-E 3.0 x8 slots (Low-profile)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8