Workstations

1.Single AMD EPYC™ 7002/7003 Series Processor 2.8 DIMMs; up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3.5 PCI-E 4.0 x16 (FH), 2 PCI-E 4.0 x8 (FH) 4.Integrated IPMI 2.0 + KVM with dedicated LAN • Software Out of Band License  key (SFT-OOB-LIC) included  for OOB BIOS management 5.4 internal 3.5" SATA3 drive bays and 4 internal 2.5" drive bays M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key

1. Single Socket R4 (LGA 2066) supports Intel® Xeon® W-2200 processor, Intel® Xeon® W-2100 processor 2. Intel® C422 chipset 3. Up to 512GB reg. ECC LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 4. 3 PCI-E 3.0 x16 (8/16/16, 48 lanes), 1 PCI-E 3.0 x4, M.2 Interface: 2 PCI-E 3.0 x4 M.2 Form Factor: 22110/2280 M.2 Key: M-Key (RAID 0,1 support) U.2 Interface: 2 PCI-E 3.0 x4 5. ALC 1220 7.1 HD Audio, 1 COM, 5GbE and GbE LAN, 2 USB 3.0 (front) 6. 4 internal 3.5" drive bays 7. 900W High Efficiency Power Supply

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2 GbE LAN ports via Intel i210 5. 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5" SATA drive bays; optional 2 SATA or NVMe 6. Broadcom 3008 SAS3 IT mode (AOC-S3008L-L8E) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5 Hot-swap 8cm redundant PWM fans 9. 1600W Redundant Power Supplies Platinum Level

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM ) 4. SIOM Network card, 1 dedicated IPMI LAN port 5. 1 VGA, 2 USB 3.0 ports 6. 8 Hot-swap 3.5" SATA3 or 6 Hot-swap 3.5" SATA3 + 2 NVMe U.2 7. 2x 8cm 14k RPM middle fans 8. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2x 10GBase-T with Intel® X557 5. 36 Hot-swap 3.5" SAS/SATA drive bays with SES3 (24 front + 12 rear); 4 Internal fixed 2.5" drive bays 2 Hot-swap 2.5" NVMe/SATA (rear, optional) 6. SAS3 via Broadcom 3008 controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 7 High-performance 8cm PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

1. Quad socket R (LGA 2011) supports Intel® Xeon® processor E5-4600 v2 (12-Core)** or E5-4600 (8-Core) family, w/ QPI up to 8.0 GT/s 2. Up to 1TB* DDR3 1866MHz ECC Registered DIMM; 32x DIMM slots * Depends on memory configuration 3. 4x PCI-E 3.0 x16 (2 in x8) Slots 4. Intel® i350 Dual port GbE LAN 5. I/O ports: 2x GbE LAN, 1x Dedicated LAN for IPMI Remote Management, 1x VGA, 1x COM port, 4x USB 2.0 6. 5x 3.5" Hot-swap SATA3 HDD Bays 7. 1400W Redundant Digital PS Platinum Level (95%)

Intel® Core™ i7 / i7 Extreme Edition, and Intel® Xeon® 5600/5500/3600/3500 series (QPI up to 6.4 GT/s) Up to 24GB DDR3 1600/1333/1066/800 ECC / non-ECC Un-Buffered DIMM 2 (x16) PCI-Express 2.0, 1 (x4) PCI-Express (using x8 slot), 1x 32-bit PCI Slots Intel® Dual 82574L Gigabit Ethernet Controller Supports nVidia® SLI™ and ATI® CrossfireX ™ Technology 8x 3.5" Hot-swap SATA Drive Bays 865W Low-Noise High Efficiency Cooling-Redundant Power Supply Tower or Rackmount PWM Fan Speed Control

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Single socket R3 (LGA 2011) supports Intel® Core™ i7 Processor Extreme Edition and X-Series, Intel® Xeon® processor E5-2600 v4†/ v3, E5-1600 v3 2. Intel® X99 Chipset 3. Up to 128GB non-ECC UDIMM DDR4, frequency up to 3300MHz (OC); 8x DIMM slots 4. 4 PCI-E 3.0 x16, 2 PCI-E 2.0 x1 (in x4) 5. ALC 1150 HD Audio 6. Removable 3.5" and 2.5" HDD/SSD cages with tool-less trays for up to 10 drives; 2x 5.25" Peripheral Drive Bays 7. Dual GbE LAN with Intel® I210-AT 8. 2x 12cm front cooling fans, 1x 12cm rear exhaust fan 9. 750W Multi-output Power Supply

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. Single socket H3 (LGA 1150) supports Intel® Xeon® E3-1200 v3, 4th gen. Core i7/i5/i3, Pentium, Celeron processors 2. 4x 3.5" Hot-swap drive bays, 2x 2.5" fixed drive bays 3. 1x PCI-E 3.0 x16 slot, 1x Mini-PCIe with mSATA support