Supermicro

Intel® Atom processor E3940 (9.5W, 4C) Intel® Goldmont microarchitecture 14nm System-on-Chip Up to 8GB 1866MHz DDR3L Non-ECC SO-DIMM in 1 socket Dual LAN with Intel® Ethernet Controller I210-IT 1 M.2 B-Key 2280, 1 Full size Mini-PCI-E, 1 SATA 3.0 1 HDMI, 1 VGA, 1 48-bit LVDS, Intel® HD Graphic 3 independent displays 2 USB 3.0 ports, 4 USB 2.0 ports, 4 COM ports, 1 SATA 3.0, 8-bit GPIO, SMBus Supports 12V DC power input Wide temperature suppot from -30°C to 75°C Supports on board TPM 2.0

1. 4U High Density Storage JBOD Chassis with capacity 90 x 3.5" hot-swappable HDDs in 45 drive bays 2. Single Expander Board and Front/Rear Backplane Boards support SAS3/2 or SATA3 HDDs with 12Gb/s throughput 3. 4 x Mini-SAS HD ports for Internal / External Cascading Expander Combination for high performance, high availability or high redundancy requirements 4. 1x IPMI port for Remote System Power on/off 5. Support NTP for time synchronization 6. 2000W (1+1) 96% efficient Titanium level power supplies 7. 7 x 92mm high efficient hot-swappable fans for best system cooling 8. Ideal for Cloud backup, data Replication or High desnsity Archive Storage Applications

Single socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v6/v5, Intel® 7th/6th Gen. Core™ i3 series, Intel® Celeron® and Intel® Pentium® Intel® C236 chipset Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4 DIMM slots Quad LAN w/ Intel® X540 10GBase-T Support Intel® VHD with selected CPU 6 SATA3 (6Gbps) via C236; RAID 0, 1, 5, 10 I/O: 1 VGA, 2 COM, TPM header 5 USB 3.0 (2 rear, 2 via header(s), 1 Type A), 6 USB 2.0 (2 rear, 4 via header(s)) 2 SuperDOM with built-in power M.2 NGFF connector M.2 Interface: PCI-E 3.0 x4 Form Factor: 2260, 2280, 22110 Key: M-Key Double Height Connector

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. 8x 288-pin DDR4 DIMM sockets up to 256GB VLP RDIMM 3. 2x 2.5" 6Gb/s SATA3 HDD/SSD

1. Single socket FCBGA 1667, 8-Core, 45W, 16 Threads; support Intel® Xeon® processor D-1541 2. Up to 128GB DDR4 VLP ECC RDIMM 2133/2400MHz in 4 sockets

Supermicro MCP-320-81801-0B SC818G 2x 4056 fan tray HF RoHS PBFree

1U chassis, support motherboard sizes: ATX 12" x 10" and Micro ATX 9.6" x 9.6" 4 x 3.5" hot-swap SAS/SATA SAS or enterprise SATA HDD only recommended 1U 4-Port 12Gbps Backplane Support 4x3.5 1U 600W redundancy PWS meet PMBus 1.2 with high efficiency and high power density 1 full height expansion slot(s) 4 x 40x28mm PWM fan(s) Optional 2 x fans for AOC cooling

1. Extreme High Density Storage Chassis support 24x (12 front + 12 middle) 3.5" SAS/SATA 12Gb/s Hot-Swap Bays 2. Single Expander Backplane Boards support SAS/SATA HDDs with 12Gb/s throughput 3. 4x Mini-SAS HD ports for Internal/External Cascading 4. 1000W (1+1) Redundant High-efficiency Titanium Level power supplies with PMBus 5. Optimize cooling with 5x 8cm Hot-Swap redundant fans 6. JBOD Power Control Board with IPMI for remote monitor and power on-off; Internal Connection Cables Included

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 8 PCI-E 3.0 x16 slots (support up to 8 double width GPU), 2 PCI-E 3.0 x8, 1 PCI-E 2.0 x4 4. Up to 24 Hot-swap 2.5" drive bays; 10x 2.5" drives supported natively, 1 NVMe based M.2 SSD 5. 2x 10GBase-T LAN ports via Intel C622 6. 8 Hot-swap 92mm RPM cooling fans 7. 2000W (2+2) Redundant Power Supplies Titanium Level (96%+)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 4 PCI-E 3.0 x16 (LP) (GPU tray for GPUDirect RDMA), 2 PCI-E 3.0 x16 (LP, CPU tray) 4. Support 8 Tesla V100 with 300GB/s NVLINK 5. Dual 10GBase-T LAN with Intel® X540 6. 16 Hot-swap 2.5" SAS/SATA drives (Optional 8x NVMe drives supported), 2 NVMe based M.2 SSD 7. 8x 92mm cooling fans 8. 2200W Redundant (2+2) Power Supplies; Titanium Level (96%+)

Intel Atom Processor C3955, Single Socket FCBGA1310 supported, CPU TDP support 32W System on Chip Up to 256GB Registered ECC DDR4-2400MHz, Up to 64GB Unbuffered ECC/Non-ECC DDR4-2400MHz; in 4 DIMM slots

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 2 PCI-E 3.0 x16 slots 4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN