Server

Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, Intel® C622 Up to 1.5TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2666MHz,

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s Intel® C622

Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported Intel® C622 Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots

AMD EPYC™ 9004 series Processors System on Chip Up to 3TB 3DS ECC RDIMM, DDR5-4800MHz in 12 DIMM slots 3 PCIe 5.0 x16 2 PCIe 5.0 x8 Up to 6 USB 3.0 ports(4 rear + 2 via header) 8 SATA3 6 PWM 4-pin Fans with tachometer status monitoring M.2 Interface: 2 PCIe 4.0 x4 M.2 Form Factor: 2280, 22110

8th Generation Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium®, Intel® Xeon® E processor (Coffee Lake-S) Server, Intel® Xeon® E processor (Coffee Lake-S) Workstation., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP Intel® C246 Up to 64GB Unbuffered ECC/non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x16 slot), 1 PCI-E 3.0 x4, 1 PCI-E 3.0 x1, 2 PCI-Ex16 slots are running at NA/16, or 8/8 1 PCI, 1 - 5V PCI 32bit M.2 Interface: 2 PCI-E 2.0 x4, RAID 0 & 1 M.2 Form Factor: 22110 M.2 Key: M-Key M.2#1~2 are shared with SATA #6~7, M.2#2 is shared with U.2 U.2 Interface: 1 PCI-E 3.0 x4 1 HDMI port, 1 DVI - I port, 1 DP (DisplayPort) port, HDMI is HDMI2.0a, DP is DP1.2, Intel® C246 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Single LAN with Intel® Ethernet Controller I210-AT Single LAN with Intel® PHY I219LM LAN controller Support vPro

1. Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s 2. Intel® C621 3. Up to 1.5TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots 4. 1 PCI-E 3.0 x32 Left Riser Slot, 1 PCI-E 3.0 x16 Right Riser Slot, 1 PCI-E 3.0 x16 for Add-On-Module (AOM) M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key 5. 1 VGA port 6. Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10 7. Dual LAN with GbE from C621

1. Intel® C232 chipset 2. Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4 DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)

1. Intel® C236 chipset 2. Up to 64GB Unbuffered ECC/non-ECC UDIMM DDR4 2400MHz; 4 DIMM slots 3. 2 PCI-E 3.0 x16 (run at 16/NA or 8/8), 2 PCI-E 3.0 x1, and 2 5V PCI 32-bit slots

Intel® Xeon® Scalable Processors, Intel® Xeon® W-32xx Processor. Single Socket LGA-3647 (Socket P) supported, CPU TDP support 205W TDP Intel® C621 Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz

Dual AMD EPYC™ 7003/7002 Series Processors 2.4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs 3.Expansion slots: 3 PCI-E 4.0 x16 slots, 3 PCI-E 4.0 x8 slots M.2 Interface: 1 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4.10 SATA3, 2 SATADOM, 4 NVMe 5.Dual Gigabit LAN ports, 1 dedicated IPMI LAN Port 6.ASPEED AST2600 BMC graphics 7.2 USB 2.0 ports (rear), 4 USB 3.0 ports (2 rear, 2 headers) 8.8x 4-pin PWM Fans & Speed control

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W Intel® C622 chipset Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots

1. Intel® C236 chipset 2. Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4 DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)