4U / Tower

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 4. 2x 1GbE LAN ports 5. 7.1 HD Audio 6. 8 Hot-swap 3.5" SAS3/SATA3 drive bays (SATA3 dafault), 1 M.2 slot, 2 NVMe support with opt. cables 7. 1200W High-efficiency Power Supply Platinum Level Certified

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 4. 8 Hot-swap 3.5" SATA3 drive bays; RAID 0, 1, 5, 10 5. Optional DVD-ROM drive, optional support: 2 fixed 2.5" NVMe/SSD/HDD, 1 M.2 support 6. 3 Peripheral 5.25" bays 7. 2x 1GbE LAN ports with Intel® X722 8. 1280W Redundant Power Supplies Platinum Level (94%)

4th Gen Intel® Xeon® Scalable processor support Intel® C741 Chipset 5 PCIe 5.0 x16, 1 PCIe 5.0 x8, 2 NVMe M.2 slots 2x 2.5" Front access SATA drive bays with hot swap 2x 5.25" peripheral drive bays 4x internal 3.5" SATA rotating drive bays for easy access up to 4x NVMe SSD support with opitonal cables and converter trays Compact and quiet operation

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 11 PCI-E 3.0 x16 (FH, FL) slots 1 PCI-E 3.0 x8 (FH, FL in x16 slot) 4. Up to 24 Hot-swap 2.5" drive bays; 10x 2.5" drives supported natively, 1 NVMe based M.2 SSD 5. 2x 10GBase-T LAN ports via Intel C622 6. 8 Hot-swap 92mm RPM cooling fans 7. 2000W (2+2) Redundant Power Supplies Titanium Level (96%+)

Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options 5. 60x 3.5" Hot-swap SAS3/SATA3 drive bays; 2x 2.5" rear Hot-swap SATA drive bays; optional 6 NVMe bays 6. Broadcom 3108 SAS3 HW RAID controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5x 8cm hot-swap redundant PWM fans PWM fans 9. 2000W Redundant Power Supplies Titanium Level (96%) Certified 10. Front 3.5" LCD display

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2 GbE LAN ports via Intel i210 5. 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5" SATA drive bays; optional 2 SATA or NVMe 6. Broadcom 3008 SAS3 IT mode (AOC-S3008L-L8E) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5 Hot-swap 8cm redundant PWM fans 9. 1600W Redundant Power Supplies Platinum Level

1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v6/v5, Intel® 7th/6th Gen. Core™ i3 series, Intel® Celeron® and Intel® Pentium® 2. Intel® C232 chipset 3. Up to 64GB Unbuffered ECC UDIMM DDR4 2400MHz; 4x DIMM slots 4. 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x8, and 1 PCI-E 3.0 x4 (in x8 slot) 5. 1 VGA, 1 COM, 2 GbE LAN, dedicated IPMI LAN, 2 USB 2.0 (front) 6. 4 Fixed 3.5" drive bays + 2 External 5.25" drive bays 7. 300W High-efficiency Power Supply

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots

1. Quad socket R1 (LGA 2011) supports Intel® Xeon® processor E7-8800 v4/v3, E7-4800 v4/v3 family (up to 24-Core) 2. Up to 6TB DDR3 1600MHz ECC RDIMMs and LRDIMMs; 96x DIMM slots 3. Up to 11x PCI-E 3.0 slots (4 x16, 7 x8)

2x Intel Xeon E5-2630 v2 128GB memory per node 6x 2.5in 400GB SSD Hard Drives 30x 3.5in 4TB SATA3 HDDs Internal 2.5in OD drives (mirrored 80GB SSD) 4x 10G SFP+ via 2x AOC-STGN-I2S

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified