4 GPU

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 4 PCI-E 3.0 x16 slots (3 GPU/MIC cards optional), 1 PCI-E 3.0 x8 LP slot 4. Intel X540 Dual port 10GBase-T 5. 4 Hot-swap 2.5" SATA3 Drive Bays 6. 1600W Redundant Power Supplies Platinum Level (94%+) 7. 10 Counter rotating fans w/ optimal fan speed control 8. Smart server management tools

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. Expansion slots, Single Root Complex, 11 PCI-E 3.0 x16 (FH, FL) slots

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 4 PCI-E 3.0 x16 (LP) (GPU tray for GPUDirect RDMA), 2 PCI-E 3.0 x16 (LP, CPU tray) 4. Support 8 Tesla V100 with 300GB/s NVLINK 5. Dual 10GBase-T LAN with Intel® X540 6. 16 Hot-swap 2.5" SAS/SATA drives (Optional 8x NVMe drives supported), 2 NVMe based M.2 SSD 7. 8x 92mm cooling fans 8. 2200W Redundant (2+2) Power Supplies; Titanium Level (96%+)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 4 PCI-E 3.0 x16 slots (4 NVIDIA GPU/Xeon Phi cards opt.), 2 PCI-E 3.0 x8 (in x16) LP slot 4. Intel i350 Dual port GbE LAN 5. 2 Hot-swap 2.5" drive bays, 2 internal 2.5" drive bays 6. 9x 4cm heavy duty counter-rotating fans with air shroud & optimal fan speed control 7. 2000W Redundant Power Supplies Platinum Level (94%+)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 4 PCI-E 3.0 x16 slots (GPU/MIC, opt.), 1 PCI-E 3.0 x8 (in x16) low-profile slot

***The price is only indicative - it has not yet been determined by the manufacturer*** 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 20 PCI-E 3.0 x16 support up to 20 single width GPU; 1 PCI-E 3.0 x8 (FH, FL in x16 slot) 4. 24 Hot-swap 3.5" drive bays (2 Optional U.2 NVMe 2.5" drives) 5. 2x 10GBase-T LAN ports via Intel C622 6. 8 Hot-swap 92mm RPM cooling fans 7. 2000W (2+2) Redundant Power Supplies Titanium Level (96%+)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 4 PCI-E 3.0 x16 slots (GPU/MIC, opt.), 1 PCI-E 3.0 x8 (in x16) low-profile slot

Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots. 4 PCI-E 3.0 x16 slots 2 PCI-E 3.0 x8 (1 in x16) slots support Thunderbolt 2.0 AOC, 1 PCI-E 2.0 x4 (in x8) slot; Up to 4 NVIDIA® GPU. I/O ports: 1 VGA, 2 COM, 2 GbE, 10 USB 2.0, & 1 IPMI Dedicated LAN. 8 Hot-swap 3.5", 3 Fixed 5.25" and 1 Fixed 3.5" Drive Bays. 4 Heavy Duty Fans, 2 Exhaust Fans, and 2 Active Heatsink with Optimal Fan Speed Control. 2000W High efficiency (96%) Redundant PSU; Titanium Level. Tower or Rackmount GPU Kit for passive GPU/Xeon Phi support (MCP-320-74701-0N-KIT).