4 GPU

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 4 PCI-E 3.0 x16 slots (GPU/MIC, opt.), 1 PCI-E 3.0 x8 (in x16) low-profile slot

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 4 PCI-E 3.0 x16 (LP) (GPU tray for GPUDirect RDMA), 2 PCI-E 3.0 x16 (LP, CPU tray) 4. Support 8 Tesla V100 with 300GB/s NVLINK 5. Dual 10GBase-T LAN with Intel® X540 6. 16 Hot-swap 2.5" SAS/SATA drives (Optional 8x NVMe drives supported), 2 NVMe based M.2 SSD 7. 8x 92mm cooling fans 8. 2200W Redundant (2+2) Power Supplies; Titanium Level (96%+)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 4 PCI-E 3.0 x16 (FHFL) slots, 2 PCI-E 3.0 x16 (LP) slots 4. 2 Hot-swap 2.5" SAS/SATA drive bays, 2 Internal 2.5" drive bays 5. 2x 10GBase-T LAN ports via Intel X540 6. 9 Heavy duty 4cm counter-rotating fans with air shroud & optimal fan speed control 7. 2000W Redundant Power Supplies Titanium Level (96%)

1. Acoustically optimized for quiet operation Closed-loop liquid cooling for CPUs and GPUs 2. 4 liquid-cooled NVIDIA A100 GPUs with NVIDIA® NVLink™ (2+2) installed 3. Dual 4th Gen Intel® Xeon® Scalable Processors, 6444Y (16 cores at 3.6Ghz) installed 4. Dual-port active-cooled NVIDIA Connect-X6 Dx 25G Network Adapter installed 5. Supermicro Cloud Orchestrator AI software stack

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 3 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x8 Low-profile slot 4. Intel i350 Dual port GbE LAN 5. 2 Hot-swap 2.5" drive bays, 2 internal 2.5" drive bays 6. 7x 4cm heavy duty counter-rotating fans with air shroud & optimal fan speed control 7. 2000W Redundant Power Supplies Titanium Level (96%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 4 PCI-E 3.0 x16 (FHFL), 1 PCI-E 3.0 x16 (LP) and 1 PCI-E 3.0 x8 (LP) 4. 2 Hot-swap 2.5" NVMe drive bays, 2 Internal 2.5" SATA drive bays 5. Support 1x M.2 2242/2260/2280, Support M.2 SATA and NVMe 6. 2x 10GBase-T LAN ports via Intel X540 7. 9 Heavy duty 4cm counter-rotating fans with air shroud & optimal fan speed control 8. 2000W Redundant Power Supplies Titanium Level (96%)