Podrobné informace
End of Life produkt, cena je pouze informativní, připravili jsme pro Vás tyto alternativy.
|
|
 |
Key Features
- Compute Intensive Application
- HPC, Data Center
- Enterprise Server
- Financial Analysis
- Mission-critical applications
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 24 DIMM slots
3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM
card support (flexible networking)
Note: must bundle with Network card
4. IPMI 2.0 + KVM with dedicated LAN
5. 6 Hot-swap 2.5" NVMe drive bays
6. Video via Aspeed AST2400 BMC
7. 4x 8cm heavy duty PWM fans with
air shroud
8. 2200W Redundant Power Supplies
Titanium Level
9. 2 M.2 Cards support
|
|
|
Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 2 DIMMs, 1 HDD/NVMe and 1 SIOM card per node). Please contact your Supermicro sales rep for special requirements.
|
|
 |
|
|
|
|
|
 |
| SYS-2028BT-HNR+ |
- SuperServer 2028BT-HNR+ (Black)
|
| |
|
Super X10DRT-B+ |
| |
|
| CPU |
- Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 145W TDP)
- Dual Socket R3 (LGA 2011)
|
| Cores / Cache |
- Up to 22 Cores† / Up to 55MB† Cache
|
| System Bus |
|
| Note |
† BIOS version 2.0 or above is required |
| |
|
| |
|
| Memory Capacity |
- 24x 288-pin DDR4 DIMM slots
- Up to 3TB† ECC 3DS LRDIMM, 768GB ECC RDIMM
|
| Memory Type |
- 2400†/2133/1866/1600MHz ECC DDR4 SDRAM 72-bit
|
| DIMM Sizes |
- RDIMM: 32GB, 16GB, 8GB, 4GB
- LRDIMM: 64GB, 32GB
- 3DS LRDIMM: 128GB
|
| Memory Voltage |
|
| Error Detection |
- Corrects single-bit errors
|
| |
|
| Chipset |
|
| IPMI |
- Support for Intelligent Platform Management Interface v.2.0
- IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
- ASPEED AST2400 BMC
|
| Network |
- Must bundle with at least one SIOMnetwork card
|
| Video |
|
| |
|
| LAN |
- 1 RJ45 Dedicated IPMI LAN port
|
| USB |
|
| Video |
|
| Others |
- M.2 and SATA DOM for boot drive only
|
|
|
|
|
| Form Factor |
|
| Model |
|
| |
|
| Width |
|
| Height |
|
| Depth |
|
| Package |
- 9.76" (H) x 24.65" (W) x 45.28" (D)
|
| Weight |
- Gross Weight: 85 lbs (38.6kg)
- Net Weight: 54.5 lbs (24.7 kg)
|
| Available Colors |
|
| |
|
| Buttons |
- Power On/Off button
- UID button
|
| LEDs |
- Power status LED
- HDD activity LED
- 2 Network activity LEDs
- Universal Information (UID) LED
|
| |
|
| PCI-Express |
- 2 PCI-E 3.0 (x16) Low-profile slots
- 1 SIOM card (must bundle with network card)
|
| |
|
| Hot-swap |
- 6 Hot-swap 2.5" NVMe drive bays
|
| |
|
| Fans |
- 4 heavy duty 8cm PWM fans with air shroud
|
| |
| 2200W Redundant Power Supplies with PMBus |
| Total Output Power |
- 1200W/1800W/1980W/2090/2200W
|
Dimension
(W x H x L) |
|
| Input |
- 1200W: 100-127Vac / 50-60Hz
- 1800W: 200-220Vac / 50-60Hz
- 1980W: 220-230Vac / 50-60Hz
- 2090W: 230-240Vac / 50-60Hz
- 2090W: 180-220Vac (for UL/cUL only)
- 2200W: 220-240Vac (for UL/cUL only)
- 2090W: 230-240Vdc (for CCC only)
|
| +12V |
- Max: 100A / Min: 0A (100-127Vac)
- Max: 150A / Min: 0A (200-220Vac)
- Max: 165A / Min: 0A (220-230Vac)
- Max: 174.17A / Min: 0A (230-240Vac)
- Max: 174.17A / Min: 0A (180-220Vac, UL/cUL only)
- Max: 183.33A / Min: 0A (220-240Vac, UL/cUL only)
- Max: 174.17A / Min: 0A (230-240Vdc, CCC only)
|
| 12Vsb |
|
| Output Type |
|
| Certification |
  UL/cUL/CB/BSMI/CE/CCC
Titanium Level
[ Cert. in progress ] |
| |
|
| BIOS Type |
- 128Mb SPI Flash EEPROM with AMI BIOS
|
| |
|
| RoHS |
|
| Environmental Spec. |
- Operating Temperature:
10°C to 35°C (50°F to 95°F)
- Non-operating Temperature:
-40°C to 70°C (-40°F to 158°F)
- Operating Relative Humidity:
8% to 90% (non-condensing)
- Non-operating Relative Humidity:
5% to 95% (non-condensing)
|
|
|
|
|
 |
|
|
|
|
|
|
Part Number
|
Qty
|
Description
|
| Motherboard / Chassis |
MBD-X10DRT-B+
CSE-217BHQ+-R2K22BP |
4
1 |
Super X10DRT-B+ Motherboard
2U Chassis |
| Backplane |
BPN-ADP-6NVME3-1UB |
4 |
6x NVMe ports and 50A power sourcing daughter card for Big Twin |
| Backplane |
BPN-NVME3-217BHQ |
1 |
2U 24-Port 4-Node NVMe Backplane Support 6x2.5 |
| Drive Tray(s) |
MCP-220-00127-0B-BULK |
24 |
Black gen3 Hotswap 2.5 NVMe drive tray, Orange tab/Lock/Bulk |
| Parts |
MCP-240-21721-0N |
1 |
217B BigTwin type I (Impact) BPN retention bkt assy |
| Air Shroud |
MCP-310-21706-0B |
4 |
SC217B/827B BigTwin air shroud for X10DRT-B+ |
| Riser Card |
RSC-P-6 |
4 |
RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS |
| Riser Card |
RSC-R1UTP-E16R |
4 |
1U RHS TwinPro Riser card with one PCI-E x16 slot |
| Heatsink / Retention |
SNK-P0047PSM |
4 |
1U Passive Front CPU Heat Sink w/ a Middle Air Channel for X9, X10 2U Twin^2+ and Twin Pro^2 Series Servers |
| Heatsink / Retention |
SNK-P0057PS |
4 |
1U High Performance Passive CPU Heat Sink for X9, X10 Systems Equipped w/ a Narrow ILM MB |
| FAN 1 |
FAN-0162L4 |
4 |
80x80x38 mm, 13.5K RPM, HCP, LMV, and LPC Cooling Fan,RoHS/REACH |
| Power Supply |
PWS-2K22A-1R |
2 |
1U 2200W Redundant Power Supply Titanium, 45(W) X 40(H) X 48 |
|
|
|
