WIO

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (FHFL) slots, 1 PCI-E 4.0 x16 (LP) slot Intel® Ethernet Controller X550 2x 10GbE RJ45 4x hot-swap 3.5'' Hybrid SATA3/NVMe drive bays, SAS3 with additional SAS controller card; Onboard 1x NVMe/SATA M.2 Redundant Platinum 500W Power Supply

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 Mezzanine for HBA cards

4th Generation AMD EPYC™ 9004 Series Processor ASPEED AST2600 24 DIMM slots with 2 DIMM per channel (up to 6TB DDR5-4000MHz(1R)/3600MHz(2R)) OR 12 DIMM slots with 1 DIMM per channel (up to 3TB DDR5-4800MHz) 1 AIOM/OCP NIC 3.0 Slot For 24 SATA/SAS and 16 SATA/SAS Configuration Options for up to 4 PCIe 5.0 x16 Slots or

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 2 PCI-E 3.0 x16 (FHHL) slots 4. 10 Hot-swap 2.5" SAS/SATA drive bays; (default 8 SAS3, 2 SATA3) 5. SAS3 (12Gbps) via Broadcom 3108 6. Intel® i350 Dual port GbE LAN 7. I/O ports: 2x SuperDOM, 1x VGA, 1x COM, 6x USB 3.0 (4 rear, 2 front) 8. Optional 2x 2.5" NVMe drives support 9. 700W Redundant Power Supplies Platinum Level High-efficiency

1. Single AMD EPYC™ 7000-Series Processor 2. Up to 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs 3. Expansion slots: 2 PCI-E 3.0 x16 (FH/HL) slots, 1 PCI-E 3.0 x16 (LP) slot M.2 Interface: PCI-E 3.0 x2 (NVMe based) M.2 Form Factor: 2280, 22110 M.2 Key: Onboard M-key Number of M.2: 2

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (FHFL) slots, 2 PCI-E 4.0 x8 (LP) slots Intel® Ethernet Controller X550 2x 10GbE RJ45 8x hot-swap 3.5'' SATA3 drive bays, SAS3 with additional SAS controller card, Optional 2x 2.5'' Gen4 NVMe drives at rear; Onboard 1x NVMe/SATA M.2 Redundant Platinum 650W Power Supply

1. Single socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. 4x 3.5" Hot-swap SATA3 drive bays 4. 1x Slim DVD-ROM drive bay 5. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 6. 2x PCI-E 3.0 x16 FHFL, 1x PCI-E 3.0 x8 LPHL (3x AOC slots total) 7. Intel® i350-AM2 Dual port GbE LAN 8. Integrated IPMI 2.0 and KVM with Dedicated LAN 9. I/O ports: 1x VGA, 2x COM, 2x USB 3.0, 2x USB 2.0 10. 500W Redundant Power Supplies Platinum Level (94%+)

1. Single AMD EPYC™ 7002 Series Processor 2. 8 DIMMs; up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3. 2 PCI-E 4.0 x16 (FHFL) slots, 1 PCI-E 4.0* x16 (LP) slot 4. Integrated IPMI 2.0 + KVM with  dedicated LAN • Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5. 10 Hot-swap 2.5" SATA3 drive bays, Optional 2 U.2 NVMe (PCI-E 3.0) drive support via additional kit for NVMe devices 6. 2x 10GBase-T LAN ports via Broadcom BCM57416 Controller 7. 1 VGA, 7 USB 3.0 (4 rear, 2 front, 1 Type A) 8. 2 SuperDOM (Disk on Module) ports 9. 500W Redundant Power Supplies Platinum Level High-efficiency (Full redundancy based on configuration and application load)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 2x PCI-E 3.0 x16 (FHHL) - AOC support 4. Intel® X540 Dual port 10GBase-T 5. 4x 3.5" Hot-swap SAS/SATA HDD Bays for Customizable Storage 6. I/O ports: 2x SuperDOM, 1x VGA, 1x Serial, 6x USB 3.0 (4 rear) 7. 700W Redundant Power Supplies Platinum Level High-efficiency