Storage Solutions

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. 3 PCI-E 3.0 x8 (1 FHHL, 2 LPHL) expansion slots per controller; up to 3 add-on cards 4. Dual 10GBase-T LAN w/ Intel® X540; 100Mb private Ethernet between controller nodes 5. 16x 3.5" Hot-swap SAS3/SATA3 drive bays with SES2 6. SAS3 via Broadcom 3008 controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 12x 4cm PWM cooling fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

1. High Availability Storage Appliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 16 Hot-swap 3.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 12x 40mm cooling fans 7. 1200W Redundant Power Supplies Titanium Level Certified

Up to 4TB ECC DDR4-3200: LRDIMM/RDIMM 2x 25G SFP+ Ports Onboard 12x 3.5" hot-swap SAS/SATA, 4x hot-swap EDSFF Short Bays, 2x 2.5" 7mm NVMe/Hot-Swap SATA drive bays Front LED Indicator for each drive Host Bus Adapter via Broadcom® 3224 PCI-E 4.0 x16 AIOM Support + 3 PCI-E 4.0 LP Slots

Dual AMD EPYC™ 7002 Series Processors 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs Expansion slots: 1 PCI-E 4.0 x16 slot (FH, 9.5" L) [Details] Integrated IPMI 2.0 + KVM with dedicated LAN Dual-port 10GBase-T and Dual-port 10G SFP+ via Intel® X710-TM4

Up to 4TB ECC DDR4-3200: LRDIMM/RDIMM 2x 25G SFP+ Ports Onboard 12x 3.5" hot-swap SAS/SATA, 4x hot-swap EDSFF Short Bays, 2x 2.5" 7mm NVMe/Hot-Swap SATA drive bays 4x E1.S (EDSFF Short) NVMe drives RAID support via Broadcom® 3916 2x 25Gb SFP28 onboard Front LED Indicator for each drive PCI-E 4.0 x16 AIOM Support + 3 PCI-E 4.0 LP Slots

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 1 PCI-E 3.0 x16 HHHL slot, 1 PCI-E 3.0 x8 HHHL slot, 1 SIOM slot

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 60x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. Single AMD EPYC™ 7000-Series Processor 2. Up to 2TB Registered ECC DDR4   2666MHz SDRAM in 16 DIMMs 3. Expansion slots:   1 PCI-E 3.0 x16 (FH/HL) slot   M.2 Interface: PCI-E 3.0 x4    (NVMe based)   M.2 Form Factor: 2280, 22110   M.2 Key: Onboard M-key   Number of M.2: Dual 4. Integrated IPMI 2.0 + KVM with   dedicated LAN 5. 2x 10GBase-T LAN ports   via Broadcom BCM57416 6. 24 hot-swap 2.5" U.2 NVMe drive bays 7. 1200W Redundant Power Supplies   Titanium Level (96%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (FHHL) slots, 1 PCI-E 3.0 x4 (LP) slot

1. Single socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. 1 PCI-E 3.0 x4 (in x8), 1 PCI-E 3.0 x8 (in x16), 2 PCI-E 3.0 x8, 1 PCI-E 2.0 x2 (in x4), 1 PCI-E 2.0 x4 (in x8) 4. Intel® i350-AM4 Quad port GbE LAN 5. 36x 3.5" Hot-swap SAS3 HDD Bays (24 front + 12 rear); Opt. 2x 2.5" Hot-swap HDD bays (rear) 6. SAS3 via Broadcom 3008 controller; IR mode 7. Dual JBOD expansion ports 8. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 9. 7x 80mm middle cooling fans 10. 1280W Redundant Power Supplies Platinum Level (94%)