2U GPU

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 6 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x8 (in x16) slots 4. 8 Hot-swap 2.5" SAS/SATA drive bays, 2 Hot-swap 2.5" SAS/SATA/NVMedrive bays 5. 1 SIOM for flexible Networking 6. 5x 8cm heavy duty fans with optimal fan speed control 7. 2000W Redundant Power Supplies Platinum Level (94%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 6 PCI-E 3.0 x16 slots (GPU/MIC, opt.), 1 PCI-E 3.0 x8 (in x16) low-profile slot

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 6 PCI-E 3.0 x16 slots (GPU/MIC, opt.), 1 PCI-E 3.0 x8 (in x16) low-profile slot

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 4 PCI-E 3.0 x16 slots (GPU/MIC, opt.), 1 PCI-E 3.0 x8 (in x16) low-profile slot

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 4 PCI-E 3.0 x16 slots (GPU/MIC, opt.), 1 PCI-E 3.0 x8 (in x16) low-profile slot

1.High Density 2U System with NVIDIA® HGX™ A100 4-GPU 2.Supports 4 A100 40GB SXM4 GPUs 3.Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ 4.On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN 5.Dual AMD EPYC™ 7002 Series Processors 6.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 7.4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP) 8.4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid) 9.2x 2200W Titanium Level power supplies with Smart Power Redundancy 2x 3000W Titanium Level Redundant Power Supply option coming soon